ASUS TUF GAMING H570-PRO WIFI
Full description ASUS.
- Intel® LGA 1200 socket: Ready for 11th and 10th Gen Intel®Core™ processors
- Enhanced power solution: 8+1 DrMOS power stages, six-layer PCB, ProCool socket, military-grade TUF components and Digi+ VRM for maximum durability
- Comprehensive cooling: Enlarged VRM heatsink, PCH fanless heatsink, M.2 heatsinks, hybrid fan headers and Fan Xpert 4 utility
- Next-gen connectivity: PCIe 4.0, rear USB 3.2 Gen 2×2 Type-C®, front panel header for USB 3.2 Gen 1 Type-C® and Thunderbolt 4™ support
Supports Intel® 14 nm CPU
Supports Intel® Turbo Boost Technology 2.0 and Intel® Turbo Boost Max Technology 3.0**
* Refer to http://www.asus.com for CPU support list.
** Intel® Turbo Boost Max Technology 3.0 support depends on the CPU types.
Non-ECC, Un-buffered Memory*
Dual Channel Memory Architecture
Supports Intel® Extreme Memory Profile (XMP)
* 11th Gen Intel® processors support 3200/2933/2800/2666/2400/2133 natively.
* 10th Gen Intel® Core™ i7/i9 processors support 2933/2800/2666/2400/2133
natively, others will run at the maximum transfer rate of DDR4 2666MHz.
* Refer to http://www.asus.com for the Memory QVL (Qualified Vendors Lists),
and memory frequency support depends on the CPU types.
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